In process automation, safety and reliability are of critical importance. To ensure this requires precise and robust sensors and measuring instruments that guarantee perfect measurement, control, monitoring, or fault analysis.
Baumer is expanding its CX series with the 4th Sony CMOS sensor generation Pregius S with up to 24 megapixel resolution. Thanks to a pixel size of mere 2.74 µm and backside illumination pixel architecture, the camera has a very compact design of 29×29 mm and offers very high resolutions with excellent image quality and improved sensitivity for stable image evaluations.
The Baumer inductive distance sensor family IF08 now extended by small cubic designs in stainless steel housings with a yet large measurement range up to 3 mm and setting options via IO Link interface is outstanding and unique on the market. This way, the sensors provide double benefit.
It is often difficult to integrate the rotary encoder in applications with moving parts and limited installation space. However, precise position measurement in the smallest possible design is essential especially in medical technology or for attachments in mobile automation. This is why Baumer is enhancing its product portfolio of the MAGRES EAM series with the EAM300, the smallest absolute multi-turn encoder with CANopen interface.
The inductive sensors include integrated measured value filters with five pre-set filters, which significantly simplifies the evaluation process through the parameterization of the primary sensor function via the IO-Link interface and reduces the variant diversity. Applications with very high demands for resolution or speed can be resolved with a single sensor type.
The new laser distance sensor families OM20 and OM30 with IO-Link are perfectly suited to continue the trend towards more efficient, compact machines and systems without any compromise regarding the sensor performance in optical distance measurement applications.
The Baumer optoelectronic sensors O200 are the first miniature sensors on the market to offer 3D CAD data with integrated beam path. This saves valuable time in the engineering process, which previously was quite an effort when integrating the beam path from data sheets.
