In process automation, safety and reliability are of critical importance. To ensure this requires precise and robust sensors and measuring instruments that guarantee perfect measurement, control, monitoring, or fault analysis.
A new type of sensor efficiently protects pumps against dry run and cavitation. With PAD20, sensor expert Baumer presents an intelligent solution for varied applications and industries. The principle is simple: The innovative PAD20 analysis sensor will quickly and reliably detect even tiniest bubbles of air and gas in fluids.
Heat-resistant process sensors for CIP applications, perfect timing for container exchange in warehousing, smart engineering from food processing to packaging: sensor expert Baumer is going to present clever solutions for the food and beverage industry at Anuga FoodTec in Cologne (April 26 to 29, 2022).
The CleverLevel PL20 point level sensor from Baumer wins its next trophy. In the vote for Product of the Year, readers of the trade journal Computer & Automation voted the proven process sensor into second place in the sensor category.
Measuring conductivity in the smallest space: The new Baumer PAC50 process sensor sets new standards and is perfect for small-sized production installations. The new product development from the Swiss sensor company scores with high performance tightly packed in a very compact design.
Baumer remains on course for growth. The Group of Companies specialized in smart sensor solutions for factory and prozess automation is currently building a new, modern R&D center at the Frauenfeld headquarter in Switzerland at a cost of 20 million Swiss francs. The new building is the second major investment focussing on innovation within few years, following the High-Tech Center in Stockach (opening in 2018).
Baumer adds new OT300 and OT500 sensors to their portfolio of photoelectric sensors. The sensors offer a large detection range of up to 2.6 m thanks to time-of-flight measurement. Independent of the angle of installation, the sensors will reliably detect objects, even with a demanding surface. Due to the compact design, 3D CAD data with integrated beam path and standardized IO-Link interface they easily integrate and enable convenient parameterization.